LCP for Microwave Packages and Modules
A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP) at package, component and system levels, providing a detailed look at everything you need to know to get up-to-speed on the subject, including successful design details, techniques and potential pitfalls.5 LCP for surface mount interconnects, packages, and modules This chapter presents the design and development of thin-film LCP ... The utilization of an all- LCP enclosure provides a hermetic environment for microwave and millimetre- wave monolithic integrated circuits (MMICs). ... Section 5.2 introduces a bandpass feed-through concept that aims to ultimately remove vias from package feed-throughsanbsp;...
| Title | : | LCP for Microwave Packages and Modules |
| Author | : | Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara |
| Publisher | : | Cambridge University Press - 2012-06-21 |
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